3M 467MP Adhesive Transfer Tape

3M 467MP Transfer Tape Overview

3M 467MP Transfer Tape is a reliable adhesive solution designed for demanding industrial applications. This clear transfer tape features a high-performance acrylic adhesive on one side with a polycoated kraft paper liner. At just 2.3 mil (0.06 mm) thick, it delivers exceptional strength for heavy-duty bonding, including metals and high-surface-energy plastics.

Key Benefits

• High-temperature and chemical resistance
• Repositionable before final set for precise alignment
• Ideal for splicing, laminating, and mounting applications

No special surface preparation is required. 3M 467MP bonds fully within 48 hours at room temperature and performs reliably in applications such as appliance assembly, sports equipment manufacturing, and industrial component bonding.

Conclusion

3M 467MP Transfer Tape delivers strong, durable adhesion in extreme environments. Its versatility, ease of use, and long-term performance make it a trusted industrial standard.

Product Features

• High-performance 200MP acrylic adhesive
• Repositionable for accurate placement before bonding
• Designed for industrial bonding, splicing, and mounting
• Excellent adhesion to metals and high-energy plastic surfaces

3M 467MP Transfer Tape Specifications

Adhesive Type	Acrylic 200MP
Backing Material	Polycoated Kraft Paper
Thickness	2.3 mil (0.06 mm)
Temperature Resistance	400°F short-term / 300°F long-term

Frequently Asked Questions

What is 3M 467MP used for?
It is commonly used in electronics, signage, and automotive applications requiring strong, long-lasting adhesion.

Recommended for nameplate bonding and ideal for point-of-purchase displays and signage.

3M 467MP is the most popular adhesive transfer tape in the USA.

Why Choose 3M 467MP Transfer Tape?

The thin 2.3 mil 200MP acrylic adhesive delivers high shear strength, excellent heat and chemical resistance, and durable bonding to metals and high-surface-energy plastics. Ideal for nameplates, graphics, laminating, and splicing while maintaining a low-profile bond line.